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Low cost and ease of manufacturability with new materials

High-performance materials are often expensive and can present challenges in printed circuit board (PCB) production. Common challenges include bonding copper to the substrate, machining features in the substrate, and matching the coefficient of thermal expansion (CTE) between materials – and of course, switching to unfamiliar materials requires time to educate manufacturers. Note that ease of manufacturability can help offset high raw material costs.

As part of the 5G/6G MAESTRO project, work on this page is supported by the Office of Advanced Manufacturing in the National Institute of Standards and Technology (NIST), under the Federal Award ID Number 70NANB22H050.

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