|
Term |
Definition |
|
3D |
3 dimensional |
|
AI |
Artificial intelligence |
|
AOI |
Automated optical inspection |
|
AR |
Aspect ratio |
|
ASIC |
Application specific integrated circuit |
|
ATC |
Available transfer capability |
|
BGA |
Ball grid array |
|
BTC |
Bottom terminated component |
|
CCC |
Current carrying capacity |
|
CMT |
Compression mount |
|
CNC |
Computer numerical control |
|
CPU |
Central processing unit |
|
CT |
Computed tomography |
|
CTE |
Coefficient of thermal expansion |
|
DC-LGA |
Dual compression LGA |
|
DFM |
Design for manufacturing |
|
DFN |
Dual-flat no-leads |
|
DfR |
Design for rework |
|
DI |
Deionized |
|
DPPM |
Defective parts per million |
|
ECM |
Electronic control module |
|
EMI |
Electromagnetic interference |
|
EMS |
Electronic manufacturing service |
|
FCBGA |
Flip chip ball grid array |
|
FEA |
Finite element analysis |
|
HAST |
Highly accelerated stress testing |
|
HCCC |
High CCC |
|
I/O |
Input/output |
|
IACS |
Industrial automation and control system |
|
IPA |
Isopropyl alcohol |
|
IPC |
Standards organization, (formally known as the Institute of Printed Circuits, Institute for Interconnecting and Packaging Electronic Circuits) |
|
JRP |
Joint reinforcement paste |
|
KOZ |
Keep out zone |
|
LCP |
Low pin count |
|
LED |
Light-emitting diode |
|
LF |
Lead-free |
|
LGA |
Land grid array or large grid array |
|
LLCR |
Low level contact resistance |
|
MEMS |
Micro electro mechanical systems |
|
MP |
Melting point |
|
MRL |
Manufacturing readiness level |
|
MSA |
Master Service Agreement |
|
MSL |
Moisture sensitivity level |
|
OEM |
Original equipment manufacturer |
|
PCB |
Printed circuit board |
|
PCBA |
Printed circuit board assembly |
|
PCIe |
Peripheral component interconnect express |
|
PFAS |
Per- and polyfluoroalkyl substances |
|
PGA |
Pin grid array |
|
PNP |
Pick and place |
|
POP |
Package on package |
|
POR |
Point of record |
|
PTH |
Plated through hole |
|
QA |
Quality assurance |
|
QC |
Quality control |
|
QFN |
Quad flat no leads |
|
RF |
Radio frequency |
|
SAC |
Sn-Ag-Cu |
|
SDS |
Safety data sheet |
|
SI |
Signal integrity |
|
SIR |
Surface insulation resistance |
|
SLI |
Second level interconnect |
|
SM |
Surface mount |
|
SMT |
Surface mount technology |
|
STIM |
Solder TIM |
|
TC |
Thermal conductivity |
|
TDR |
Time domain reflection |
|
TDT |
Time domain transmission |
|
TIM |
Thermal interface material |
|
TLPS |
Transient liquid-phase sintering |
|
TRL |
Technology readiness level |
|
WA |
Warm assembly |
