|
Term |
Definition |
|
ADAS |
Advanced driver assistance system |
|
AI |
Artificial intelligence |
|
AR |
Augmented reality |
|
ASIC |
Application-specific IC |
|
ASTM |
American Society for Testing and Materials, aka ASTM International |
|
CAD |
Computer aided design |
|
CAPEX |
Capital expenditure |
|
CFD |
Computational fluid dynamics |
|
CFX |
Connected factory exchange |
|
CIM |
Computer integrated manufacturing |
|
CIS |
Complex integrated systems |
|
CoW |
Chip on wafer |
|
DFA |
Design for assembly |
|
DFT |
Design for test |
|
EDA |
Electronic design automation |
|
EIC |
Electronic integrated circuit |
|
EM |
Electromagnetic |
|
EMS |
Electronics manufacturing service |
|
FATP |
Final assembly, test and packaging |
|
FEA |
Finite element analysis |
|
HALT/HASS |
Highly accelerated life testing/Highly accelerated stress screening |
|
HBM |
High bandwidth memory |
|
HLA |
Higher level assembly |
|
HPC |
High performance computing |
|
HW |
Hardware |
|
IPC |
IPC, Association Connecting Electronics Industries, formerly the Institute for Interconnecting and Packaging Electronic Circuits |
|
JEDEC |
JEDEC Solid State Technology Association |
|
KPI |
Key performance indicator |
|
LED |
Light emitting diode |
|
LiDAR |
Light detection and ranging |
|
MEMS |
Microelectromechanical systems |
|
MIL-STD |
Military Standard |
|
MR |
Mixed reality |
|
MRL |
Manufacturing readiness level |
|
OEM |
Original equipment manufacturer |
|
OPEX |
Operational expenditure |
|
OSAT |
Outsourced semiconductor assembly and test |
|
PA |
Power amplifier |
|
PCB |
Printed circuit board |
|
PCBA |
PCB assembly |
|
PIC |
Photonic integrated circuit |
|
RDL |
Redistribution layer |
|
RF |
Radio frequency |
|
SAE |
Society of Automotive Engineers |
|
SDK |
Software development kit |
|
SEC/GEM |
Semiconductor Equipment Communication Standard/Generic Equipment Model |
|
SiP |
System-in-package |
|
SMT |
Surface mount technology |
|
SoC |
System-on-chip |
|
SW |
Software |
|
TRL |
Technology readiness level |
|
UBM |
Under-bump metallization |
|
UCIe |
Universal Chiplet Interconnect Express |
|
VCSELS |
Vertical-cavity surface-emitting laser |
|
VR |
Virtual reality |
|
WL |
Wafer level |
|
XR |
Extended reality |
