Published
Editing or Reviewing Content
-
Board Assembly
-
Complex Integrated Systems
-
High-Performance and Cloud Computing Applications
-
mmWave Applications
-
PCB (second wave of content)
-
mmWave Materials and Test (second wave of content)
Expected publication date: 2Q24
Creating Content
-
Board Assembly (second wave of content)
-
PCB (third wave of content)
-
Sustainable Electronics (second wave of content)
Expected publication date: 3Q or 4Q24
Forming Team and/or Defining Scope
-
Packaging and Heterogeneous Integration
-
Semiconductors
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