AR/VR/MR Devices
In extended reality (XR) applications, wafer-level components drive transformative commercialization by enhancing performance and miniaturizing devices like glasses and goggles. Shrinking yet powerful camera modules capture the real world with clarity, while projection modules seamlessly merge digital and physical realms. Wafer-level packaged components, including light sources and micro-electromechanical systems (MEMS), form the core, enabling size reduction and integration into eyeglasses and contact lenses. This marks a paradigm shift, turning headsets into seamless extensions of daily life—a milestone in achieving immersive XR experiences.
In developing an economical, high-output process for miniaturized light engines, a preferred approach is top-down assembly. Architectural process design focuses on three key factors—component attachment, passive1 alignment, and wafer-level package placement—to broaden the process window without compromising cost, yield, or performance. Active alignment processes in manufacturing widen the allowable passive components process window through meticulous lens placement and alignment.
During design, evaluation of the physical connection between components is imperative. For instance, anisotropic conductive adhesive proves suitable for bare-die attachment, meeting stringent bond strength requirements. The assessment of high-precision automated equipment for wafer-level die placement, ensuring single-digit µm precision, repeatability, and throughput, is crucial.
While each proposed solution plays a role, engineering expertise emerges as the linchpin, exerting the most significant impact on the process design approach and the success of CIS. This underscores its pivotal role in engineering miniaturized optical modules for high-volume production.
Return to topic overview
1 Passive alignment of components relies on guiding structures or marks to ensure correct positioning. Active alignment involves using feedback from optical test signals to adjust the positioning.