Board Assembly Acronyms
Term | Definition |
3D | 3 dimensional |
AI | Artificial intelligence |
AOI | Automated optical inspection |
AR | Aspect ratio |
ASIC | Application specific integrated circuit |
ATC | Available transfer capability |
BGA | Ball grid array |
BTC | Bottom terminated component |
CCC | Current carrying capacity |
CMT | Compression mount |
CNC | Computer numerical control |
CPU | Central processing unit |
CT | Computed tomography |
CTE | Coefficient of thermal expansion |
DC-LGA | Dual compression LGA |
DFM | Design for manufacturing |
DFN | Dual-flat no-leads |
DfR | Design for rework |
DI | Deionized |
DPPM | Defective parts per million |
ECM | Electronic control module |
EMI | Electromagnetic interference |
EMS | Electronic manufacturing service |
FCBGA | Flip chip ball grid array |
FEA | Finite element analysis |
HAST | Highly accelerated stress testing |
HCCC | High CCC |
I/O | Input/output |
IACS | Industrial automation and control system |
IPA | Isopropyl alcohol |
IPC | Standards organization, (formally known as the Institute of Printed Circuits, Institute for Interconnecting and Packaging Electronic Circuits) |
JRP | Joint reinforcement paste |
KOZ | Keep out zone |
LCP | Low pin count |
LED | Light-emitting diode |
LF | Lead-free |
LGA | Land grid array or large grid array |
LLCR | Low level contact resistance |
MEMS | Micro electro mechanical systems |
MP | Melting point |
MRL | Manufacturing readiness level |
MSA | Master Service Agreement |
MSL | Moisture sensitivity level |
OEM | Original equipment manufacturer |
PCB | Printed circuit board |
PCBA | Printed circuit board assembly |
PCIe | Peripheral component interconnect express |
PFAS | Per- and polyfluoroalkyl substances |
PGA | Pin grid array |
PNP | Pick and place |
POP | Package on package |
POR | Point of record |
PTH | Plated through hole |
QA | Quality assurance |
QC | Quality control |
QFN | Quad flat no leads |
RF | Radio frequency |
SAC | Sn-Ag-Cu |
SDS | Safety data sheet |
SI | Signal integrity |
SIR | Surface insulation resistance |
SLI | Second level interconnect |
SM | Surface mount |
SMT | Surface mount technology |
STIM | Solder TIM |
TC | Thermal conductivity |
TDR | Time domain reflection |
TDT | Time domain transmission |
TIM | Thermal interface material |
TLPS | Transient liquid-phase sintering |
TRL | Technology readiness level |
WA | Warm assembly |