Design for CIS

Traditional design methodologies follow a monolithic approach with fewer technologies being integrated at the packaging level. With this approach, design flows prioritized implementation, followed by analysis of implemented designs (e.g., sign-off flows), and then discrete analysis was done per physics domain such as electromagnetic (EM), mechanicals, thermals, etc. With CIS, a more holistic, integrated approach is needed.

System design planning

Given the nature of CIS-based products that include several technologies coupled with advanced packaging it is critical to verify that a CIS will perform within the defined product specifications earlier in the design definition process. Doing so will allow for parallel implementation of the components and functions in the complex system and minimize risk of integration challenges without exploding design schedules. Additionally, system planning design tools need to evolve intrinsically to support flows for technology selection in addition to technology implementation. This requires support for “what-if” analysis for a large number of scenarios and optimization for design space exploration.

Multi-domain and multi-physics analysis

CIS for heterogenous applications will combine different materials and components and analysis tools needed to support co-simulation of thermals, mechanical aspects, reliability, RF, photonics, power integrity, and EM emissions. Simulation tools also need to support a combination of materials that including high-density ICs, organic rigid/flex substrates and even evaluate the impact of contaminants.

EDA standards are key enablers

To support CIS products, a system implementation will typically require multiple iterations across different components and functions of the system including evaluating selection of materials, integration technologies, and system-level design floor planning. This results in an explosion of electronic design automation (EDA) tasks, and it is essential to have a seamless integration of EDA flows based on neutral and interoperable data formats. Standardized data formats will: (i) ensure high-quality data exchange between flows, say, from design to analysis; (ii) allow co-design between silicon, package, and board design domains and (iii) accuracy in component models from component manufacturers to CIS product design teams.

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