|
Term |
Definition |
|
A&D |
Aerospace and defense |
|
ABF |
Ajiamoto build-up film |
|
ADAS |
Advanced driver-assistance systems |
|
AI |
Artificial intelligence |
|
AOI |
Automatic optical inspection |
|
AR |
Aspect ratio |
|
AVI |
Automated visual inspection |
|
BOM |
Bill of materials |
|
CAD |
Computer-aided design |
|
CAF |
Conductive anodic filament |
|
CAM |
Computer-aided manufacturing |
|
CCL |
Copper-clad laminates |
|
COF |
Chip-on-film |
|
CTE |
Coefficient of thermal expansion |
|
Df |
Dissipation or loss factor |
|
DFT |
Design for test |
|
Dk |
Relative permittivity or dielectric constant |
|
EDACS |
Enhanced Digital Access Communication System |
|
EDX |
Energy dispersive X-Ray |
|
EICC |
Electronic Industry Citizenship Coalition ® |
|
EOL |
End of life |
|
ESCA |
Electron spectroscopy for chemical analysis |
|
FC-CSP |
Flip-chip chip-scale package |
|
FIB |
Focused ion beam |
|
FPGAs |
Field-programmable gate arrays |
|
Gbps |
Gigabits per second |
|
HDI |
High-density interconnect |
|
HVLP |
Hyper very low profile |
|
HVM |
High-volume manufacturing |
|
HW |
Hardware |
|
IC |
Integrated circuit |
|
IP |
Intellectual property |
|
IT |
Information technology |
|
JEDEC |
JEDEC Solid State Technology Association |
|
JPCA |
Japan Printed Circuit Association |
|
KGD |
Known good die |
|
LCP |
Liquid crystal polymer |
|
LVM |
Low-volume manufacturing |
|
MDA |
Manufacturing defect analysis |
|
ML |
Machine learning |
|
MOT |
Maximum on temperature |
|
MRL |
Manufacturing readiness level |
|
MSAP |
Modified semi-additive process |
|
NPI |
New product introduction |
|
PCB |
Printed circuit board |
|
PFAS |
Per- and polyfluoroalkyl substances |
|
PIM |
Passive intermodulation |
|
PTFE |
Polytetrafluoroethylene |
|
RDL |
Redistribution layer |
|
ROI |
Return on investment |
|
SAP |
Semi-additive process |
|
SEM |
Scanning electron microscope or scanning electron microscopy |
|
SEMI |
Semiconductor Equipment and Materials Initiative |
|
SI |
Signal integrity |
|
SW |
Software |
|
TAB |
Tape-automated bonding |
|
Tbps |
Terabits per second |
|
Td |
Decomposition temperature |
|
Tg |
Glass transition temperature |
|
TRL |
Technology readiness level |
|
UL |
Underwriters laboratory |
|
XPS |
X-ray photoelectron spectroscopy |