Data Flow Architecture
Vision
Data volumes in electronics manufacturing facilities are growing at exponential rates. Pervasive data velocities measured as the data collection rates from equipment increased from less than 1 Hz in the 1990s to 10 Hz in 2020 and are expected to be at 100 Hz in a few years with some dedicated sensor data (e.g., IoT) collection rates in excess of 10 KHz. Delivering higher data volumes at real-time and near-real-time rates will increase the availability of equipment parametric data to positively impact yield and quality.
Data from equipment, maintenance, yield, inventory management, manufacturing execution system (MES) and enterprise resource planning (ERP) existed for several years; however, analytics tools are evolving to leverage and merge multiple data sources to investigate relationships, detect anomalies, and predict events.
Scope
The emergence of big data in electronics manufacturing operations is discussed in terms of the “5Vs Framework”, as follows:
Volume (how much data in absolute terms),
Velocity (how fast is that data being transmitted between elements),
Variety (or data merging from multiple, often heterogeneous, sources),
Veracity (or data quality), and
Value (or application of analytics, automation and control).
The “5 Vs” are foundational to appreciate widespread adoption of big data analytics by the electronics manufacturing ecosystem.
Technical Needs, Gaps and Solutions
The technology issues surrounding data flow architectures, the associated needs, technology status of those needs, as well as gaps and challenges to overcome, are summarized below. The time period considered is from 2023 to 2033.
Technology Status Legend
For each need, the status of today’s technology is indicated by label and color as follows:
In-table color + label key | Description of Technology Status |
---|---|
Solutions not known | Solutions not known at this time |
Solutions need optimization | Current solutions need optimization |
Solutions deployed or known | Solutions deployed or known today |
Not determined | To be determined |
Definitions for “Gap,” “Challenge,” and “Current Technology Status” are below:
Term | Definition |
---|---|
GAP | This is what is missing or what below in performance, in today’s technology, to meet the need for year X. |
CHALLENGE | Why is it difficult to meet the need in year X? Typically, this is some particular technical consequence of that need that is inherently difficult. |
CURRENT TECHNOLOGY STATUS in year X | How well does today’s technology and solutions meet the need in year X? |
Table 1. Smart Manufacturing Data Architecture Needs, Gaps, and Today’s Technology Status with Respect to Current and Future Needs
| ROADMAP TIMEFRAME | |||
TECHNOLOGY ISSUE | TODAY (2023) | 3 YEARS (2026) | 5 YEARS (2028) | 10 YEARS (2032) |
DATA VELOCITY AND VOLUME | ||||
NEED | Everything connected or tracked:
| Everything connected wirelessly, with high reliability equivalent to wired Ethernet, where needed.
| ||
CURRENT TECHNOLOGY STATUS | Solutions need optimization | |||
GAP | Cost-efficient “first mile” wireless connectivity | Terminal cost, heavily influenced by battery life | ||
CHALLENGE | Wireless terminal equipment cost | High reliability requires 5G solutions in licensed spectrum, so an expensive solution with processor-intensive terminals | ||
NEED | Micro-second latencies within cell. Seconds from machine to servers. | Micro-second latencies from machine to function | ||
CURRENT TECHNOLOGY STATUS | Solutions need optimization | |||
GAP | Wired connectivity only to centralized servers | Ubiquitous edge and fog computing | ||
CHALLENGE | Low-latency and high-reliability communications | Cost and power efficiency of fog compute | ||
NEED | Add local, in-cell wireless connectivity | |||
CURRENT TECHNOLOGY STATUS | Solutions not known | |||
GAP | Simultaneous low-latency, high-reliability wireless communications | |||
CHALLENGE | Industry development is slow; only now working on sub-ms packet lengths | |||
NEED | Maximum downtime <10 minutes per year | |||
CURRENT TECHNOLOGY STATUS | Solutions need optimization | |||
GAP | High availability network | |||
CHALLENGE | Heterogeneity in wireless access, including elements using unlicensed spectrum with potential interference | |||
DATA VARIETY | ||||
NEED | Harmonization of data formats (proprietary, standardized, etc.)
| |||
CURRENT TECHNOLOGY STATUS | Solutions not known | |||
GAP | Lack of consensus for data format harmonization | |||
NEED | Identification of common data formats for exchange of data between disparate equipment within the factory cell (machine-to-control-to-machine) | Harmonization of data formats for exchange of data between disparate equipment within the factory cell (machine-to-control-to-machine) | Standardized formats for data exchange between disparate equipment within the factory cell (direct machine-to-machine). Intelligence likely to remain centralized.
| |
CURRENT TECHNOLOGY STATUS | Solutions deployed or known | Solutions need optimization | ||
GAP | Disparate solutions deployed (some legacy, some proprietary, and some based on new standards) | Standardization needed (but it will take up to 10 years for widespread adoption)
| ||
CHALLENGE | Manufacturing lines with legacy equipment |
| ||
DATA VERACITY | ||||
NEED | Complete traceability and validation of all data flows and their provenance across the enterprise facilities and product lifecycle | |||
CURRENT TECHNOLOGY STATUS | Solutions not known | |||
GAP | See “data in motion” in Security for Smart Manufacturing | |||
DATA VALUE (Multi-factory floor/multi-company analysis) | ||||
NEED | Distributed data architectures for cross-company analysis, for large companies | Easy access to data and ease of use to drive small company adoption. | ||
CURRENT TECHNOLOGY STATUS | Solutions need optimization
| Solutions not known
| ||
GAP | Production use cases for large companies | Simpler architectures, ease of configuration and maintenance | ||
CHALLENGE | Establishing the value proposition | Need on-machine analytics to simplify | ||
NEED | Integrate and correlate data across different segments in the manufacturing supply chain for the purpose of supply chain visualization, flow control | Solutions for sharing meaningful answers for quality diagnosis (e.g., for root-cause analysis) without sharing low-level data | ||
CURRENT TECHNOLOGY STATUS | Solutions need optimization | Solutions not known | ||
GAP | Lack of solutions that span the entirety of the length of supply chains | No common practice, custom agreements only | ||
CHALLENGE | No common industry practice or solution | Lack of trust for smaller customers |
Approaches to address Needs, Gaps and Challenges
Table 2 considers approaches to address the above needs, gaps and challenges. The evolution of these is projected out over a 10-year timeframe using technology readiness levels (TRLs).
In-table color key | Range of Technology Readiness Levels | Description |
---|---|---|
2 | TRL: 1 to 4 | Levels involving research |
6 | TRL: 5 to 7 | Levels involving development |
9 | TRL: 8 to 9 | Levels involving deployment |
Table 2. Data Flow Architecture Potential Solutions
|
| EXPECTED TRL LEVEL* | |||
TECHNOLOGY ISSUE | POTENTIAL SOLUTIONS |
TODAY (2023) | 3 (2026) | 5 (2028) | 10 |
Data velocity and volume | Deploy a mixture of connectivity technologies | 7 | 8 | 9 | 9 |
5G for simultaneous high-reliability, ultra-low latency | 5 | 7 | 8 | 9 | |
Move to edge (for ms latency) and on-machine (for sub-ms latency) computing to reduce latency, standardized for cost efficiency | 6 | 9 | |||
Data value | Compressed data flows that are friendly to on-the-fly data analytics – data format already easily compressed. | 8 (for database solutions) | |||
5 (ML friendly) | 8 (ML friendly) |
In electronics manufacturing facilities, an intelligent, flexible factory floor requires flexible, resilient, low-latency communications between
(a) AI-enhanced factory floor control systems and enterprise management systems and
(b) manufacturing/process equipment, material flows, and building facilities.
The trend to move computing closer to the edge will remove some latency. Communication connectivity for equipment, material flows, and facilities will also need the low latency and high reliability of wired Ethernet, but delivered wirelessly. 5G solutions are emerging to address this, but the cost point and power consumption remain high. Other solutions, such as industrial 802.15.41-based protocols are much more power efficient and cost effective, but lack the required performance, particularly in terms of resiliency, because of their use of shared spectrum.
The value proposition for a comprehensive data flow architecture supporting a wide variety of manufacturing facility data types is well understood, but there are a number of barriers that industry needs to address for such solutions to become ubiquitous:
Data collection rapidly outpaced data integration, architecture, and analytics. Today, vast amounts of data are going unused. Data is only helpful if it is leveraged for actionable insights which lead to more efficient processes and ultimately positive ROI.
A range of research and industry experience demonstrate that between 60 and 90% of all Industry 4.0 pilot or Proof of Concept (PoC) projects never progress beyond the initial stage. Often driven by technical rather than operational teams, little focus is given to how to scale-up if the pilot is a success.
Most companies fail to form an early view on the comprehensive target-state technology stack that is scalable and enabled for analytics.
Industry needs to address the lack of harmonization for factory-floor data formats, both for machine-to-controller and machine-to-machine.
Smaller companies will struggle to adopt best practices and cutting-edge solutions unless installation, configuration and management are greatly simplified. Architectural simplifications, e.g. embedded analytics, will help.
It will be a return-on-investment challenge to incorporate legacy equipment into the overall data flow architecture.
In manufacturing, execution is everything. Manufacturing leaders must shift their target from mere data collection to data-informed execution. To do so, this begins with creating data integration at every level of operations, whether between shop floor machines or top floor enterprise systems. This integration must be done with proper data governance and architectures, centralizing data into data lakes which ultimately allow for high quality analytics across multiple departments. Applications, data management, infrastructure needs, security and edge process/control must be considered to select the right platform.
IEEE Standards Association, “IEEE Standard for Low-Rate Wireless Networks“, https://standards.ieee.org/ieee/802.15.4/7029/, 2020/