Component-level

Solutions not known

Solutions not known at this time

Solutions need optimization

Current solutions need optimization

Solutions deployed or known

Solutions deployed or known today

Not determined

TBD

ROADMAP TIMEFRAME

TECHNOLOGY ISSUE

TODAY (2024)

3 YEARS (2027)

5 YEARS (2029)

10 YEARS (2034)

COMPONENT-LEVEL ISSUE #1: 01005 (0402 metric) and smaller size chip rework

NEED

01005 (0402 Metric) rework. Equipment capital or highly skilled personnel to complete this type of rework

Smaller sizes than 01005 (0402 metric) components needed to be reworked, e.g., 0201 metric. Increased equipment capital or highly skilled personnel to complete this type of rework

CURRENT TECHNOLOGY STATUS

Solutions deployed or known

Solutions need optimization

Equipment technology available. No demand/cost feasibility for equipment.

Developments needed. No demand/ cost feasibility for equipment.

GAPS

• This is a training gap.

  • There are currently numerous methods including stencil, pin transfer and solder ball methods for hand soldering.

  • The precision placement method using a rework station with split vision is another method.

  • A more robust method with less capital-intensive equipment would be desired. These need to be flushed out and suggested procedures added to 7711/21 doc.¹

• Most efficient method is hand soldering method.

• Need more optical/ magnification aids to view and align these parts. Placement accuracy may be a concern.

  • If low density parts on printed circuit board (PCB) then hand method is acceptable.

  • If high density parts on PCB then hand method (with micro tweezers) is not appropriate.

  • Equipment needs optical zoom and placement accuracy to handle the component.

• Need to develop a removal process which leaves some solder on the pad to enable attach of new part.

• Reflow of new part is also a challenge. Rework versus scraping board. IR rework may not have adjacent component reflow issues versus convection air reflow

CHALLENGE

Increasing 1^st pass yield and reducing cycle time for 01005 rework

How practical is it to rework 0201 metric components in high density applications.

COMPONENT-LEVEL ISSUE #2: PoP (Package on Package) rework (multiple substrates) (up to 4 PoP stack up)

NEED

Process challenge. Need high process precision control.

Thinner layers for POP component substrates- increased warpage. (CTE issues)

CURRENT TECHNOLOGY STATUS

Solutions deployed or known

Equipment to rework PoP components is available. PoP stack ups will not likely increase  from up to 4 in the near to long term as component development technologies are going into other areas,.

GAPS

• Skills gap in profiling for PoP rework.

• Materials gap in matching of coefficient of thermal expansions (CTEs) between the various solder/laminate materials.

CHALLENGE

• Selectively removing and replacing specific layers without affecting the other layers in the component stack.

• Proper tooling and identifying the type of tooling needed. This includes stencil printing or application of tacky flux/ dipping paste.

COMPONENT-LEVEL ISSUE #3: Large BGA rework and Socket rework requirements

NEED

Equipment update requirements: optical and component handling/placement issues. Standard for components delta T is typically <10C. For large packages keeping a low delta T is a challenge.

BGA rework and sockets requirements (90 mm/100 mm and above).

Package size will continue to increase from 100 mm sockets to potentially up to 125 mm-130 mm for BGA sockets.

130 mm BGA sockets.

150 mm BGA sockets.

CURRENT TECHNOLOGY STATUS

Solutions need optimization

Solutions not known

Some availability of equipment.

New developments in equipment needed.

GAPS

• Bottom side heating and top side heating, more heating uniformity. Best systems currently could do 15C delta T. Need < 10C delta T.

• Need nozzle vendors to better understand turbulence of hot air onto top and bottom of part.

• Need IR vendors to have larger working areas and improved bottom side heating elements including multi-zone bottom heaters.

CHALLENGES

• Keeping delta T low. No understanding of turbulence of hot air onto top and bottom of part.

• Split vision optical equipment not designed for these sizes of part.

• ·Planarity issues of part during rework.

• Weight concerns

• Vacuum pick concerns for a larger heavier package.

• Planarity issues with component and board- more issues related to warpage.

COMPONENT-LEVEL ISSUE #4: Micro-package rework QFN/BTC/DFN

NEED

Component handling and vision alignment. (Adjacent component issues)

(Chip-scale packages (CSPs): 1.5mm square package rework)

(CSPs: 1mm square package rework)

(CSPs: 1mm square package rework)

(Quad-flat, no lead (QFN)/ BTC/ dual-flat, no lead (DFN): 1mm square package with some bottom terminations (14 terminations)).

(QFN/ BTC/ DFN: 1mm square package with increased number of bottom terminations (12)).

(QFN/ BTC/ DFN: 1mm square package with increased number of bottom terminations (10)).

CURRENT TECHNOLOGY STATUS

Solutions deployed or known

Some rework equipment can handle these small packages. IR rework sources are available so the component does not move during reflow. More difficult to do with convection.

GAPS

• Better component handling of micro component packages. Hand-held infrared (IR) rework tools or other precision heating sources that do not disturb the packages.

• More robust connections of micro pads to laminate.

• QFN/BTC: ability of solder paste to QFN. Ability of paste printing through stencil apertures)

• CSP: Application of paste printing through stencil apertures

CHALLENGES

• Preparation of board site after removal of micro-package part. During site preparation pads can be easily pulled off. Mask may be damaged during site preparation when solder wick used.

• For BTC/ QFN rework, application of paste is a challenge (either micro-stencil, printing on part or paste dispensing: area ratios are a challenge for paste printing)

COMPONENT-LEVEL ISSUE #5: Repair- Reballing high I/O Components (greater than 1000 I/O)

NEED

More cost effective and efficient reballing techniques especially for ultra-micro/ high I/O component sizes.

CURRENT TECHNOLOGY STATUS

Solutions need optimization

Large solder sphere preforms are unwieldy to use (warpage) and to manufacture (one ball missing is a defect). Otherwise stencils and a manual reballing method is required. Additional solder paste printing stencil is required when high temperature solder balls need to be attached. Some companies conduct reballing on contract: this includes specialized equipment such as laser reballing. Reballing capabilities are available in rework equipment.

GAP

For small volumes of parts, contracting component to reball is not cost-effective. Cost effective and efficient reballing for internal programs.

CHALLENGES

• Need for large amounts of tools and high operator skill set.

• Not a highly automated process.

• Increasing higher technology equipment will be used as ball count increases and pitch reduces.

COMPONENT-LEVEL ISSUE #6: BGA socket and SMT connector rework (high input/output (I/O) and fine pitch and temperature related issues for connector plastic body)

NEEDS

• Need less warpage of the component: Materials development for component. Warpage becomes worse as socket size increases and socket height decreases.

• Single site rework will require higher thermal limit connector/ socket materials.

BGA socket sizes: 100-120mm sockets, 9000 I/O, 2.5-3mm socket height

BGA socket sizes: 130mm sockets, 10000 I/O, <2mm socket height

BGA socket sizes: 150mm sockets, 150000 I/O, <1.5mm socket height

CURRENT TECHNOLOGY STATUS

Solutions need optimization

As parts get bigger, it will become more critical to have higher temperature plastic components which do not soften or warp.  This also applies to BGA socket materials. Connectors are being designed too close together so cannot remove a single connector. Coplanarity of the connectors is a concern and coplanarity during thermal cycle. Heat tolerance of connector plastic housing and adjacent connectors. Challenge of removing connector latches. Consider design of single body multi-slot connector in place of current designs. Consider removal of locking latches on connectors and replace them with a lower profile locking method.

GAPS

Better high temperature resistant connector materials for rework: lack of high temperature plastic connector materials.

CHALLENGES

• Temperature warpage issues, lowering delta T.

• Reflowing solder joints under the plastic body challenges. Very difficult to rework existing components.

• Moisture sensitivity issues.

COMPONENT-LEVEL ISSUE #7: Temperature sensitive component rework (MEMS, Sensors, LED and some BGA components- mainly sensor components)

NEED

Component manufacture development to produce components which can be assembled in SMT reflow oven and are more reworkable (heat tolerant) components/devices by design.

CURRENT TECHNOLOGY STATUS

Solutions need optimization

Thermal keep-away strategies to reduce the issue (Shielding, tape, gels and/or cooling jackets (in combination with ambient or cool air)

GAP

Lack of components which are tolerant to rework and surface mount technology (SMT) heat environment.

CHALLENGES

• General challenges to achieve reflow without affecting internal component function.

• Different alloys may be used such as low melting point alloys. Some of the low MP alloys may be prone to mechanical shock issues.

• Investigation of underfill/ surface mount (SM) adhesives to reduce mechanical shock issues.

COMPONENT-LEVEL ISSUE #8: Proliferation of new types of components to rework (large application-specific ICs (ASICs) with incomplete component data available regarding component structure and material which would affect rework (e.g., embedded components in BGA: what solder is used, what is temperature sensitivity of embedded components to better understand how to rework and replace the component successfully)

NEEDS

• Need transparency by component supplier on component data with respect to rework temperature and time limitations.

• Increased knowledge by component manufacturers with respect to rework tools, and process knowledge covering rework specifications.

• Better heat resistant materials. Consideration of alternatives such as epoxies or low temperature solders for rework.

CURRENT TECHNOLOGY STATUS

Solutions need optimization

Challenging to rework components without component data. Sometimes difficult to rework components even with component data (encapsulated die has different thermal characteristics, etc.). Rework is based on experience and guesswork/ assumptions.

GAP

Lack of component architecture data and materials used in datasheets to determine best processes for rework.

CHALLENGE

Without this information, rework profiling cannot be conducted with certainty

2

TRL: 1 to 4

Levels involving research

6

TRL: 5 to 7

Levels involving development

9

TRL: 8 to 9

Levels involving deployment

EXPECTED TRL LEVEL*

TECHNOLOGY ISSUE

POTENTIAL SOLUTIONS

 TODAY

(2024)

3
YEARS

(2027)

5
YEARS

(2029)

10
YEARS (2034)

Component-Level Issue #1

01005 (0402 Metric) and smaller component rework (0201 metric)

Equipment (0402 metric)

5

5

5

7

Manual rework (0402 metric)

8

8

8

8

Training (0402 metric)

8

8

8

8

Equipment (0201 metric)

5

5

5

5

Manual rework (0201 metric)

8

8

8

8

Training (0201 metric)

8

8

8

8

Component-Level Issue # 2

PoP rework (multiple substrates) (up to 4 PoP stack up)

High process precision control of rework equipment for 2 stack PoPs

8

8

8

8

Component-Level Issue # 3 BGA rework and Sockets requirements (90mm/ 100mm and above)

Component handling/placement.

6

8

8

8

Standard for large BGA socket (with cover) or BGA component delta T is typically <15C.

6

8

8

8

Component-Level Issue # 4 Micro-package rework (CSPs: 1.5mm square package rework) (QFN/ BTC/ DFN: 1mm square package with some bottom terminations(14 terminations))

Component handling and vision alignment.

8

8

8

8

Printing of paste using mini-stencil for very small apertures/ Low Area ratios for QFN/ BTC/ DFN components

6

8

8

8

Component-Level Issue # 5 Repair- Reballing high I/O Components (greater than 1000 I/O)

Development of more specialized equipment to reball including laser reballing

6

7

7

8

Printing paste on PCB (Stencil)

6

7

7

7

Printing paste on PCB (Jetting)

6

7

7

7

Printing paste on component (Stencil)

7

8

9

9

Dippable solder paste on component

5

6

7

8

Component-Level Issue # 6 BGA socket and SMT connector rework (high I/O and fine pitch and temperature related issues for connector plastic body)

Higher temperature resistant connector materials

5

6

6

8

Higher temperature resistant socket materials

5

6

6

8

Component-Level Issue # 7 Temperature sensitive component rework (MEMS, Sensors, LED and some BGA components- mainly sensor components)

Shielding, tape/foils, cooling jackets and gels

7

8

9

9

Heat tolerant components/devices by design

2

2

2

2

Component-Level Issue #8 Proliferation of new types of component to rework (large ASICs) with incomplete component data available regarding component structure and material which would affect rework (e.g. embedded components in BGA: what solder is used, what is temperature sensitivity of embedded components to better understand how to rework and replace the component successfully)

More transparency by component supplier on component data with respect to rework temperature and time limitations.

5

6

6

7

Increased knowledge by component manufacturers with respect to rework tools, and process knowledge covering rework specifications.

5

6

6

7

Consideration and use of alternatives such as low temperature solders/ epoxies for rework.

7

7

8

8

More complete and readily available component data regarding internal component structure and material which would affect rework (e.g. embedded components in BGA)

7

8

8

8

Readily available component data related to warpage during reflow/ rework

6

6

7

8