Encapsulant/Potting Materials
Technical Needs, Gaps and Solutions
This section covers technology issues surrounding Encapsulant/Potting Materials, the associated needs, technology status of those needs, as well as gaps and challenges to overcome, are summarized below in Table 1. The time period considered is from 2024 to 2034. Assessments of to address these gaps and challenges is presented in Table 2 as a set of potential solutions for each set of issues.
Technology Status Legend
For each need, the status of today’s technology is indicated by label and color as follows:
In-table color + label key | Description of Technology Status |
|---|---|
Solutions not known | Solutions not known at this time |
Solutions need optimization | Current solutions need optimization |
Solutions deployed or known | Solutions deployed or known today |
Not determined | TBD |
Table 1. Encapsulant/Potting Materials Gaps, and Today’s Technology Status with Respect to Current and Future Needs
TECHNOLOGY ISSUE | ROADMAP TIMEFRAME | |||
Encapsulation/Potting Materials | ||||
TODAY (2024) | 3 YEARS (2027) | 5 YEARS (2029) | 10 YEARS (2034) | |
ENCAPSULANT/POTTING MATERIALS ISSUE #1: Increased thermal conductivity while maintaining good flow/filling. TC > 2.0W/mk (up to 4 W/mk) | ||||
NEED | Need higher TC materials | Need higher TC materials (> 5 W/m.K) | ||
CURRENT TECHNOLOGY STATUS | Solutions need optimization | Solutions need optimization | ||
Have TC up to 1.5 W to 2/m-k range but need higher TC | Have TC up to 1.5 W to 2/m-k range but need higher TC | |||
GAP | Lack of high TC material with reduced cost (e.g., ceramic materials) | |||
CHALLENGES |
| |||
ENCAPSULANT/POTTING MATERIALS ISSUE #2: Non-silicone, chemical resistant low-modulus potting materials | ||||
NEED | Chemical resistance low modulus material |
|
| |
CURRENT TECHNOLOGY STATUS | Solutions need optimization |
|
| |
Modified silanes are being developed. Some are being evaluated. |
|
| ||
GAP | Silicones can cause contamination issues with different materials such as synthetic fluids |
|
| |
CHALLENGE | Chemical resistance is more of a challenge |
|
| |
ENCAPSULANT/POTTING MATERIALS ISSUE #3: Antimony (Sb) -free and halogenated-free flame retardants for encapsulants/potting | ||||
NEED | Effected materials are being added to the EU REACH list. Alternatives need to be developed/implemented. |
|
| |
CURRENT TECHNOLOGY STATUS | Solutions need optimization |
|
| |
Some materials available but there are trade-offs for use of these materials. Acceptable trade-off for alternatives need to be established. Cost considerations of alternatives |
|
| ||
GAP | Materials used are 40- to 50-year-old technologies. Novel materials may be needed. Testing and acceptance are needed. |
|
| |
CHALLENGE | Development and qualification of materials. Ever changing regulatory requirements. | Qualification of new materials in older military type specifications in various applications. |
|
|
ENCAPSULANT/POTTING MATERIALS ISSUE #4: Balance CTE needs with modulus needs for potting materials | ||||
NEED | Development of material with a balance of properties |
|
| |
CURRENT TECHNOLOGY STATUS | Solutions need optimization |
|
| |
CTE of potting materials for 2nd levels 25 to 40 and can be as low as 15-20 and so for semiconductor 8 to 10. Modulus values to 8 to 12 GPa |
|
| ||
GAP | Lack of materials for these areas- Limitations on materials used. |
|
| |
CHALLENGE | Development of new material to address this area. |
|
| |
Approaches to address Needs, Gaps and Challenges
Table 2 considers approaches to address the above needs and challenges. The evolution of these is projected out over a 10-year timeframe using technology readiness levels (TRLs).
In-table color key | Range of Technology Readiness Levels | Description |
|---|---|---|
2 | TRL: 1 to 4 | Levels involving research |
6 | TRL: 5 to 7 | Levels involving development |
9 | TRL: 8 to 9 | Levels involving deployment |
Table 2. Encapsulant/Potting Materials Potential Solutions
TECHNOLOGY ISSUE | EXPECTED TRL LEVEL* | ||||
Encapsulant/Potting Materials | POTENTIAL SOLUTIONS | TODAY (2024) | 3 (2027) | 5 (2029) | 10 |
ENCAPSULANT/ POTTING – BOARD LEVEL ASSEMBLY ISSUE #1 | Development of novel chemistries and formulation optimization | 4 | 5 | 6 | 7 |
ENCAPSULANT/ POTTING – BOARD LEVEL ASSEMBLY ISSUE #2 | Development of novel chemistries and formulation optimization | 4 | 6 | 8 | 8 |
ENCAPSULANT/ POTTING – BOARD LEVEL ASSEMBLY ISSUE #3 | Development of novel chemistries and formulation optimization | 4 | 6 | 8 | 8 |
ENCAPSULANT/ POTTING – BOARD LEVEL ASSEMBLY ISSUE #4 | Development of novel chemistries and formulation optimization | 4 | 6 | 8 | 8 |
Conclusions
Increased thermal conductivity while maintaining good flow/filling (TC > 2.0W/m-k)
Development of antimony (Sb) and halogenated free flame retardants for encapsulants/potting
Balancing CTE needs with modulus needs for potting materials
Board Assembly Acronyms
Return to Assembly Materials.