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Topic Schedule

Published

Editing or Reviewing Content

  • Board Assembly

  • Complex Integrated Systems

  • High-Performance and Cloud Computing Applications

  • mmWave Applications

  • PCB (second wave of content)

  • mmWave Materials and Test (second wave of content)

Expected publication date: 2Q24

Creating Content

  • Board Assembly (second wave of content)

  • PCB (third wave of content)

  • Sustainable Electronics (second wave of content)

Expected publication date: 3Q or 4Q24

Forming Team and/or Defining Scope

  • Packaging and Heterogeneous Integration

  • Semiconductors


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