Topic Schedule
Published
Editing or Reviewing Content
Board Assembly
Complex Integrated Systems
High-Performance and Cloud Computing Applications
mmWave Applications
PCB (second wave of content)
mmWave Materials and Test (second wave of content)
Expected publication date: 2Q24
Creating Content
Board Assembly (second wave of content)
PCB (third wave of content)
Sustainable Electronics (second wave of content)
Expected publication date: 3Q or 4Q24
Forming Team and/or Defining Scope
Packaging and Heterogeneous Integration
Semiconductors