Skip to main content
Skip table of contents

Topic Schedule


Editing or Reviewing Content

  • Board Assembly

  • Complex Integrated Systems

  • High-Performance and Cloud Computing Applications

  • mmWave Applications

  • PCB (second wave of content)

  • mmWave Materials and Test (second wave of content)

Expected publication date: 2Q24

Creating Content

  • Board Assembly (second wave of content)

  • PCB (third wave of content)

  • Sustainable Electronics (second wave of content)

Expected publication date: 3Q or 4Q24

Forming Team and/or Defining Scope

  • Packaging and Heterogeneous Integration

  • Semiconductors

Return to Guide to the iNEMI Roadmap

JavaScript errors detected

Please note, these errors can depend on your browser setup.

If this problem persists, please contact our support.