Topic Schedule
Group | Topic | Status | Expected publication date |
Applications | |||
Automotive | 3Q2023 | ||
Computing & Communications | 3Q2023 | ||
Wireless & Portable | 3Q2023 | ||
Consumer Electronics | 3Q2023 | ||
Medical Devices | 3Q2023 | ||
Aerospace & Defense | 3Q2023 | ||
Assembly fabrics | |||
Board Assembly | Creating content | 2Q2023 | |
Flexible Hybrid Electronics | Building team | ||
PCB | Creating content | 2Q2023 | |
5G Materials & Test | |||
Packaging & Heterogenous Integration | Building team | 3Q2023 | |
Components | |||
Semiconductor Technology | |||
Passive Components | |||
Connectors | |||
MEMS and Sensors | |||
Ceramic Interconnect & Photovoltaics | |||
Subsystems | |||
Power Conversion Electronics | Building team | 3Q2023 | |
Optoelectronics | |||
Mass Data Storage | |||
Cross-cutting topics | |||
Smart Manufacturing | Creating content | 1Q2023 | |
Supply Chain Resiliency | Building team | 2Q2023 | |
Thermal Management | |||
Sustainable Electronics | Creating content | 2Q2023 | |
Modeling, Simulation and Design Tools |